A mechanical engineer with a demonstrated committment to understand and improve product performance and reliability through the application of advanced analysis and test techniques.
Professional Objective
Seeking a mechanical engineering position to apply creative, analytical problem-solving skills to complex mechanical challenges.
PROBLEM-SOLVING and INITIATIVE * mechanical reliability assurance * design improvement through advanced analysis and test * physics-of-failure understanding * field failure resolution
LEADERSHIP and TEAMING, e.g. * program and project management * personnel mentoring * vendor management * technical team leadership
RESEARCH, ANALYSIS, and DESIGN, e.g. * independent and directed research management * application of advanced FEA & CFD tools * direction of CAD design work * experimental validation & qualification testing
Summary
I am a mechanical engineer with extensive thermo-mechanical and electronic packaging experience. I employ advanced analysis tools (FEA & CFD) and test techniques. I use these tools to:
* understand the complex interactions among design variables * determine root cause(s) of design and field problems * develop solutions to design and field problems * design and perform appropriate validation and qualification testing
Additional Comments
I am available for full, part time, contract, and consulting opportunities.
* Individual professionalism * Superior performance * Independence
One which provides:
* Technical support * Challenging engineering problems * Work flexibility
Target List
Experience
Raymond Iannuzzelli
35 Standish Way
Amherst, New Hampshire 03031
603-672-2701 / 603-672-2701 /
ray.iannuzzelli@alumni.upenn.edu /
PROFESSIONAL EXPERIENCE
Senior Member of Technical Staff
1987 - 2005
Digital / Compaq / HP - Marlboro, Massachusetts
1) Assured the mechanical reliability of interconnect throughout the computer/server design
2) Provided thermal & structural analytical expertise in support of product design goals, e.g. * forced convection cooling performance of components * strength of load bearing parts * stack-up tolerance impact on component performance
3) Developed analytical and experimental techniques to insure the mechanical and electrical reliability of computer interconnect. These techniques were validated and applied to over a dozen computer designs with proven field performance. e.g. * cables * sockets & connectors * components * plated-through-holes * solder joints * backplanes
4) Evaluated the thermal and structural performance of various computer components and designs early in the design phase before prototype hardware availability.
Principal Research Engineer
1983 - 1987
UNISYS - Blue Bell, Pennsylvania
Provided analytical mechanical expertise for a variety of R&D projects, e.g.
* novel or unique computer cooling devices * laser chemical deposition of PCB features * improving card cage cooling
Provided timely and informative analytical feasibility services enabling a variety of R&D projects to evolve to prototypes.
Senior Mechanical Engineer
pre 1983 -
Air Products & Chemicals Inc - Trexlertown, Pennsylvania
Insured the mechanical reliability of high-speed, cryogenic, rotating machinery:
* provide rotor-dynamic analysis & test services * design, implement, and maintain an aerodynamic cryo-test facility
1) Introduced and implemented sophisticated rotor-dynamic analyses of high-speed cryogenic radial turbines and axial flow compressors used in gas distillation plants. The analyses and validation tests helped to avoid critical speed and stability problems.
2) Saved the corporation $1 million in energy costs by planning and retrofitting a low-loss thrust bearing on all air plant axial flow compressors
Accomplishments
PROBLEM-SOLVING and INITIATIVE * Responsible for applying critical thinking skills to improve interconnect reliability * Recommended appropriate fixes for a problem involving a land grid array (LGA) interposer socket by providing an understanding of the physical causes of failure. * Saved Compaq 2 - 5 million dollars in recalls and lost sales opportunities through an analysis of a problem involving poor solder joints . The failure analysis led to manufacturing changes enabling Compaq to meet its sales goals for the division without a major recall.
LEADERSHIP and TEAMING * Responsible for project & vendor management as well as technical leadership of junior engineers * Provided program management for a new high-speed connector system in conjunction with an outside vendor and concurrent with the design phase of a major new computer server. This work led to the successful introduction of the computer, allowing the division to meet its product introduction goals. * Led an effort to qualify and introduce a major new solderless interconnect technology known as an LGA interposer socket, used on several recent major Compaq & HP server products.
RESEARCH, ANALYSIS, and DESIGN * Responsible for implementation of plans to assure product reliability * Designed and analyzed the concept of an active backplane (contains active devices) for a computer during its pre-design phase. Developed the metrics needed to insure reliability that were subsequently measured and verified in follow-on testing. * Developed dozens of mechanical models instrumental in predicting behavior and reliability of various interconnect components early in the design phase, e.g. connectors, sockets, solder joints, plated-through-holes, DC-DC converters, etc. * Developed reliability guidelines needed to mitigate risks for system designers when using BGA components.
Additional Qualifications
Education
• Calibration school, US Army Ordnance School, Aberdeen, MD. • BSME, Widener University, 3.25/4.0 • MS in Applied Mechanics, University of Pennsylvania, 3.20/4.0
Professional Development
Licensed, Professional Engineer in New Hampshire
Computer Skills
* Finite Element Analysis (ANSYS) * Computational Fluid Dynamics * MS Project, Word, Excel, Powerpoint
Memberships
American Society of Mechanical Engineers
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